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Warnings, Hype-Cycle, Alliance, Patent Wars, and Huawei’s Plans

5. TSMC’s founding CEO, Morris Chang, warns against complacency as he shares a cautionary tale from his days at TI. He emphasizes the need for TSMC’s R&D team to avoid following the path of the Navy’s decline.

4. Gartner’s 2023 Storage Hype-Cycle predicts the decline of Storage Class Memory, Copy Data Management, Enterprise Information Archiving, Persistent Memory DIMMs, and Management Software-Defined Storage. Hybrid Cloud File Data Services, once on the rise, is now heading towards disillusionment.

3. The Semiconductor Education Alliance, consisting of Arm, Arduino, Cadence, Cornell University, and others, has been established to address the challenges of talent acquisition and upskilling in the semiconductor industry.

2. Alexander Ford of Withers & Rogers suggests that while the robotic patents war is ongoing, disputes can be resolved without reaching court. Ocado and AutoStore have recently settled their legal dispute, but the overall patent war is far from over.

1. Huawei is reportedly planning to fabricate 5G chips on a 7nm process at SMIC this year. Although these chips may not be available in phones until next year, it marks a significant move for Huawei. SMIC’s 7nm process, known as N+1, offers similar or slightly larger sizes compared to TSMC’s N10 process. In the past, SMIC has already used its 7nm process for cryptocurrency mining chips.

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