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Sivers Wireless Receives Second Round of Prototype Orders from Tier-1 5G Infrastructure Vendor

Sivers Semiconductors AB subsidiary, Sivers Wireless, has received another order from its Tier-1 5G infrastructure vendor for beamformer and up/downconverter chips. These chips will be used in the next product prototype build by the customer. While the order value itself is not significant, it brings the project one step closer to the final product ramp and volume orders.

The project has been ongoing with this customer since MixComm was acquired and has undergone changes to its designs and time plans over the course of development. The first prototype order was received in 2022, and based on the first prototype build, the second version is planned for the second half of 2023.

Anders Storm, the CEO of Sivers Semiconductors, explains that despite the challenges of bringing new technology to market, this project has shown progress. The customer’s decision to make configuration changes to the final product was unrelated to Sivers. Storm is optimistic about the project and believes it has the potential to generate significant revenues once it is finalized by the customer.

Sivers Semiconductors AB is a leading technology company known for its ICs and integrated modules in the fields of Wireless and Photonics. The Wireless division specializes in mmWave products for advanced 5G systems, while the Photonics division develops and manufactures semiconductor-based optical products for optical fiber networks and communications. The company is listed on Nasdaq Stockholm under SIVE and is headquartered in Kista, Sweden.

For more information, please visit Sivers Semiconductors’ official website.

The post Sivers Wireless Receives Second Round of Prototype Orders from Tier-1 5G Infrastructure Vendor appeared first on satProviders.

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