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The upcoming Huawei Mate 60 series is expected to be equipped with power amplifier (PA) chips manufactured by Chinese chip makers for the Tiantong-1 satellite mobile communication system. The Tiantong-1 satellite offers various functions such as voice communication, image transmission, positioning, and data reporting. It enables the establishment of a satellite Internet of Things, facilitating real-time monitoring and equipment inspections, as well as emergency rescues. These capabilities lead to reduced operation and maintenance costs in power transmission and transformation processes.

PA chips play a crucial role in enabling the satellite call feature in devices. Huawei has already incorporated these chips in its Mate X3 and P60 series, which also support two-way satellite communication SMS. The purpose of PA chips is to amplify the high-frequency signal output from the communication IC (RF-IC) to the required output and supply it to an antenna.

In the case of 4G phones, approximately 5-7 PA chips are required, while 5G phones need about 16. However, it is currently unknown which specific PA chips Huawei will employ for the Mate 60 series.

In recent leaks, it has been suggested that Huawei will introduce the Mate 60 series next month. The new series is expected to feature a large circular camera system at the rear and significant design changes on the front.

Please note that the information provided above has been paraphrased and formatted for readability.

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