News

Sivers Semiconductors AB, through its subsidiary Sivers Wireless, has received an order for beamformer and up/downconverter chips from a Tier-1 5G infrastructure customer. This order, valued in the lower thousands of units, is part of the next product prototype build by the customer.

While the order value itself may not be significant, it represents a significant step towards the final product ramp and volume orders for this project. The collaboration between Sivers Semiconductors and the customer has been ongoing since the acquisition of MixComm, with design and time plan changes occurring during this period.

The first prototype order was received in 2022, and based on the initial product prototype build, a second version is planned for the second half of 2023.

CEO of Sivers Semiconductors, Anders Storm, acknowledges the challenges of bringing new technology to market. In this case, the customer has made configuration changes to the final product over time, unrelated to Sivers Semiconductors. Nonetheless, the progress made in this vital project is a positive development, as it has the potential to become one of the 5G Wireless projects with significant revenue streams once it is completed by the customer.

With this order, Sivers Semiconductors moves closer to the final product ramp and the possibility of larger volume orders. The collaboration highlights the company’s commitment to delivering high-quality products and solutions in the rapidly evolving 5G infrastructure market.

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