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The Huawei Mate 60 series is said to be equipped with power amplifier (PA) chips produced by Chinese chip manufacturers for the Tiantong-1 satellite mobile communication system. The Tiantong-1 satellite offers various functionalities such as voice communication, image transmission, positioning, and data reporting. It also enables the establishment of a satellite Internet of Things, allowing for real-time monitoring and equipment inspections, as well as facilitating emergency rescues.

In order to support satellite calls on devices, PA chips are required. These chips have been recently incorporated into Huawei’s Mate X3 and P60 series, both of which support two-way satellite communication through SMS. Power amplifier chips serve to amplify the high-frequency signal output from the communication IC (RF-IC), providing the necessary output and supplying it to the antenna.

Typically, 4G phones utilize approximately 5-7 PA chips, while 5G phones require around 16. However, there is currently no official confirmation regarding the specific PA chips that Huawei intends to use for the Mate 60 series.

According to previous leaks, Huawei is expected to launch the Mate 60 series next month. This upcoming release is rumored to feature a new circular camera system on the rear, as well as substantial design changes in the front.

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